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skyper 42 r ? by semikron rev. 5 C 05.04.2011 1 skyper ? driver core igbt driver core skyper 42 r preliminary data features ? two output channels ? integrated potential free power supply ? under voltage protection ? drive interlock top / bottom ? dynamic short cirucit protection ? shut down input ? failure management ? iec 60068-1 (climate) 40/085/56, no condensation and no dripping water permitted, non-corrosive, climate class 3k3 acc. en60721 typical applications* ? driver for igbt modules in bridge circuits in industrial application ? dc bus voltage up to 1200v footnotes isolation test voltage with external high voltage diode the isolation test is not performed as a series test at semikron the driver power can be expanded to 50c with external boost capacitors isolation coordination in compliance with en50178 pd2 operating temperature is real ambient temperature around the driver core degree of protection: ip00 this is an electrostatic discharge sensitive device (esds), international standard iec 60747-1, chapter ix * the specifications of our components may not be c onsidered as an assurance of component characteristics. components have to be tested for t he respective application. adjustments may be necessary. the use of semikron products in life support appliances and systems is subject to prior specification and written approval by semikron. we therefore strongly recommend prior consultation of our staff. absolute maximum ratings symbol conditions values unit v s supply voltage primary 16 v v ih input signal voltage (high) vs + 0.3 v v il input signal voltage (low) gnd - 0.3 v iout peak output peak current 30 a iout avmax output average current 150 ma f max max. switching frequency 100 khz v ce collector emitter voltage sense across the igbt 1700 v dv/dt rate of rise and fall of voltage secondary to primary side 100 kv/s v isol io isolation test voltage input - output (ac, rms, 2s) 4000 v v isolpd partial discharge extinction voltage, rms, q pd ! 10pc 1500 v v isol12 isolation test voltage output 1 - output 2 (ac, rms, 2s) 1500 v r gon min minimum rating for external r gon 0.8 ! r goff min minimum rating for external r goff 0.8 ! q out/pulse max. rating for output charge per pulse 50 c t op operating temperature -40 ... 85 c t stg storage temperature -40 ... 85 c characteristics symbol conditions min. typ. max. unit v s supply voltage primary side 14.4 15 15.6 v i so supply current primary (no load) 125 ma supply current primary side (max.) 800 ma v i input signal voltage on / off 15 / 0 v v it+ input treshold voltage high 12.3 v v it- input threshold voltage (low) 4.6 v r in input resistance (switching/halt signal) 10 k ! v g(on) turn on output voltage 15 v v g(off) turn off output voltage -8 v f asic asic system switching frequency 8 mhz t d(on)io input-output turn-on propagation time 1.1 s t d(off)io input-output turn-off propagation time 1.1 s t d(err) error input-output propagation time 2.3 s t perrreset error reset time 9 s t td top-bot interlock dead time 2 s c ps coupling capacitance prim sec 3 pf w weight g mtbf 2.1 10 6 h
skyper ? 42 r 1 2011-04-04 ? rev05 ? by semikron technical explanations revision 05 status: preliminary prepared by: johannes krapp this technical explanation is valid for the followi ng parts: related documents: part number: l5054301 title: data sheet skyper 42 r date code (yyww): >cw16 skyper ? 42 r content 1. introduction ...................................... ................................................... ................................................... .. 2 2. application and handling instructions ............. ................................................... .................................. 3 2.1. general instructions .............................. ................................................... .................................................. 3 2.2. mechanical instructions ........................... ................................................... ............................................... 3 3. driver interface .................................. ................................................... ................................................... 5 3.1. controller interface ? primary side pinning ....... ................................................... .................................... 5 3.2. controller interface ? primary side connection .... ................................................... ................................. 6 3.3. module interface ? secondary side ................. ................................................... ....................................... 7 3.4. module interface ? secondary side connection ...... ................................................... .............................. 8 3.5. power supply - primary ............................ ................................................... ............................................... 9 3.6. gate driver signals ? primary ..................... ................................................... ............................................ 9 3.7. shut down input (sdi) - primary ................... ................................................... ....................................... 10 3.8. gate resistors - secondary ........................ ................................................... ........................................... 10 3.9. external boost capacitors (bc) -secondary ......... ................................................... ............................... 11 4. protection features ............................... ................................................... .............................................. 11 4.1. failure management ................................ ................................................... ............................................. 11 4.2. under voltage protection of driver power supply (uv p) ................................................ ......................... 12 4.3. short pulse suppression (sps) ..................... ................................................... ...................................... 12 4.4. dead time generation (interlock top / bot) (dt) ... ................................................... ........................... 12 4.5. dynamic short circuit protection by vcesat monitori ng (dscp) ......................................... .................. 13 5. electrical characteristic ......................... ................................................... ............................................ 15 5.1. driver performance ................................ ................................................... ............................................... 15 5.2. insulation ........................................ ................................................... ................................................... ... 15 6. environmental conditions .......................... ................................................... ....................................... 16 7. marking ........................................... ................................................... ................................................... .. 17
skyper ? 42 r 2 2011-04-04 ? rev05 ? by semikron skyper 42 r 1. introduction the skyper 42 core constitutes an interface between igbt modules and the controller. this core is a ha lf bridge driver. basic functions for driving, potenti al separation and protection are integrated in the driver. thus it can be used to build up a driver solution for igbt modules. skyper 42 r is developed for systems in th e power range of 1 mva ? 8 mva. two output channels up to 50 c gate charge integrated potential free power supply for the sec ondary side short pulse suppression (sps) under voltage protection (uvp) drive interlock (dead time) top / bottom (dt) dynamic short circuit protection (dscp) by v ce monitoring and direct switch off shut down input (sdi) failure management expandable by external boost capacitors (bc) dc bus voltage up to 1200v block diagram of skyper 42 r please note: unless otherwise specified, all values in this tech nical explanation are typical values. typical value s are the average values expected in large quantities and are provided for information p urposes only. these values can and do vary in diffe rent applications. all operating parameters should be validated by user?s technical experts for each application.
skyper ? 42 r 3 2011-04-04 ? rev05 ? by semikron 2. application and handling instructions 2.1. general instructions please provide for static discharge protection dur ing handling. as long as the driver is not complete ly assembled, the input terminals have to be short-cir cuited. persons working with devices have to wear a grounded bracelet. any synthetic floor coverings mu st not be statically chargeable. even during transportation the input terminals have to be short -circuited using, for example, conductive rubber. worktables have to be grounded. the same safety req uirements apply to mosfet- and igbt-modules. when first operating a newly developed circuit, se mikron recommends to apply low collector voltage an d load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and the turn-off voltage spikes generated across the igbt. an oscillographic contr ol will be necessary. additionally, the case temperature of the module has to be monitored. when the circuit w orks correctly under rated operation conditions, short-c ircuit testing may be done, starting again with low collector voltage. 2.2. mechanical instructions dimensions ? 69 x 80 x 19 + holes ? bottom view
skyper ? 42 r 4 2011-04-04 ? rev05 ? by semikron for integrating the skyper 42 r driver core in to an inverter system an adaptor board has to be built . semikron offers a wide range of adaptor boards, e.g . for semix, semitrans or skim modules. semikron offers in addition a customer specific ada ptor board on demand. please contact your responsible sales for further information. adaptor boards for skyper 42 r skyper 42 r can be plugged or soldered on the adap tor board. soldering hints the temperature of the solder must not exceed 260 c, and solder time must not exceed 10 seconds. the ambient temperature must not exceed the specif ied maximum storage temperature of the driver. the solder joints should be in accordance to ipc a 610 revision d (or later) - class 3 (acceptability of electronic assemblies) to ensure an optimal connection between driver core an d printed circuit board. the driver is not suited for hot air reflow or inf rared reflow processes. use of support posts the connection between driver core and printed circ uit board should be mechanical reinforced by using supp ort posts. the driver board has got three holes for supports p osts. using support posts with external screw thread impr oves mechanical assembly. product information of suitable support posts and distributor contact information is available at e.g . http://www.richco-inc.com or http://www.ettinger.de .
skyper ? 42 r 5 2011-04-04 ? rev05 ? by semikron 3. driver interface 3.1. controller interface ? primary side pinning connectors connector x10, x11 (rm2,54, 10pin) 0,25mm unless otherwise noted pin signal function specification x10:01 reserved x10:02 reserved x10:03 prim_nerror_out error output low = no error; open collector output; max. 30v / 15ma (external pull up resistor necessary) x10:04 prim_nerror_in error input 5v logic; low active; high max = 3,8v; low min = 1,5v; x10:05 prim_pwr_gnd gnd for power supply and gnd fo r digital signals x10:06 prim_pwr_gnd gnd for power supply and gnd fo r digital signals x10:07 prim_top_in switching signal input (top swit ch) digital 15 v; 10 kohm impedance; low = top switch off; high = top switch on x10:08 prim_bot_in switching signal input (bottom s witch) digital 15 v; 10 kohm impedance; low = bot switch off; high = bot switch on x10:09 prim_pwr_15p drive core power supply stabilised +15v 4% x10:10 prim_pwr_15p drive core power supply stabilised +15v 4% x11:01, 02, 05-08 reserved x11:03, 04,09,10 prim_pwr_gnd gnd for power supply and gnd for digit al signals
skyper ? 42 r 6 2011-04-04 ? rev05 ? by semikron 3.2. controller interface ? primary side connection application example pins x10:01-02 and x11:01-02; x11:05-08 are reserve d. do not connect. non binding recommendation for: r error =4,75k ; c filter =1nf. a capacitor is connected to the input of the gate driver to obtain high noise immunity. with current limited line drivers, this capacitor can cause a small delay of a few ns. the capacitors have to be placed as close to the gate driver interface as possible. signal cable should be placed as far away as possi ble from power terminals, power cables, ground cabl es, dc-link capacitors and all other noise sources. control signal cable should not run parallel to po wer cable. the minimum distance between control sig nal cable and power cable should be 30cm and the cables should cross vertically only. it is recommended that all cables be kept close to ground (e.g. heat sink or the likes). in noise intensive applications, it is recommended that shielded cables or fibre optic interfaces be used to improve noise immunity. use a low value capacitor (1nf) between signal and power supply ground of the gate driver for differe ntial- mode noise suppression.
skyper ? 42 r 7 2011-04-04 ? rev05 ? by semikron 3.3. module interface ? secondary side connectors connector x100 / x200 (rm2,54, 10pin) 0,25mm unless otherwise noted pin signal function specification x100:01 sec_top_vce_cfg input reference voltage adj ustment for vce monitoring top x100:02 sec_top_vce_in input v ce monitoring top x100:03 sec_top_15p output power supply for externa l buffer capacitors stabilised +15v x100:04 sec_top_15p output power supply for externa l buffer capacitors stabilised +15v x100:05 sec_top_gnd gnd for power supply and gnd fo r digital signals x100:06 sec_top_igbt_on switch on signal top igbt x100:07 sec_top_gnd gnd for power supply and gnd fo r digital signals x100:08 sec_top_igbt_off switch off signal top igbt x100:09 sec_top_8n output power supply for external buffer capacitors stabilised -7v x100:10 sec_top_8n output power supply for external buffer capacitors stabilised -7v x200:01 sec_bot_vce_cfg input reference voltage adj ustment for vce monitoring bot x200:02 sec_bot_vce_in input v ce monitoring bot x200:03 sec_bot_15p output power supply for externa l buffer capacitors stabilised +15v x200:04 sec_bot_15p output power supply for externa l buffer capacitors stabilised +15v x200:05 sec_bot_gnd gnd for power supply and gnd fo r digital signals x200:06 sec_bot_igbt_on switch on signal bot igbt x200:07 sec_bot_gnd gnd for power supply and gnd fo r digital signals x200:08 sec_bot_igbt_off switch off signal bot igbt x200:09 sec_bot_8n output power supply for external buffer capacitors stabilised -7v x200:10 sec_bot_8n output power supply for external buffer capacitors stabilised -7v
skyper ? 42 r 8 2011-04-04 ? rev05 ? by semikron 3.4. module interface ? secondary side connection application example application example for 1200v igbt, v ceref =6,7v, t bl =2,3s, q out/pulse = 4c. any parasitic inductances within the dc-link have to be minimized. overvoltages may be absorbed by c- or rcd-snubbers between main terminals (plus and minus ) of the power module. make power patterns short and thick to reduce stra y inductance and stray resistance. the connecting leads between gate driver and igbt module must be kept as short as possible (max. 20cm ). gate wiring for top and bottom igbt or other phase s must not be bundled together. it is recommended that a 10k resistor (rge) be placed between the gate and emit ter. if wire connection is used, do not place the rge between printed circuit board and igbt module. rge has to be placed very cl ose to the igbt module. use a suppressor diode (back-to-back zener diode) between gate and emitter. the diode has to be place d very close to the igbt module. the use of a capacitor (cge) between gate and emit ter can be advantageous, even for high-power igbt modules and parallel operation. the cge should be a pproximately 10% of the cge of the igbt used. the cge has to be placed very close to the igbt module. current loops must be avoided. external boost capacitors must be placed as close to the gate driver as possible in order to minimize parasitic inductance. x2 0 0 x1 0 0 power supply top power supply bot powerdriver top powerdriver bot errorprocessingtop vcemonitoring errorprocessingbot vcemonitoring SKYPER42R userinterface x100:02inputv ce x100:08switchon x100:05gnd x100:07gnd x100:09switchoff x100:01referenceforv ce x100:03;04psforbc,+15v x100:09;10psforbc,7v x200:02inputv ce x200:08switchon x200:05gnd x 2 0 0 : 0 7 g n d x200:09switchoff x200:01referenceforv ce x200:03;04psforbc,+15v x200:09;10psforbc,7v 10k 10k r gon r goff r gon r goff 18,2k 337pf 18,2k 337pf 16f 16f 16f 16f
skyper ? 42 r 9 2011-04-04 ? rev05 ? by semikron 3.5. power supply - primary requirements of the auxiliary power supply regulated power supply +15v 4% maximum rise time of auxiliary power supply 150ms power on reset completed after 56ms the same power supply used for skyper 32 can be ta ken the supplying switched mode power supply may not b e turned-off for a short time as consequence of its current limitation. its output characteristic n eeds to be considered. switched mode power supplies with fold-back characteristic or hiccup-mode can cr eate problems if no sufficient over current margin is available. the voltage has to rise continuously. if the power supply is able to provide a higher cu rrent, a peak current will flow in the first instan t to charge up the input capacitances on the driver. its peak current value will be limited by the power supply and the effective impedances (e.g. distribut ion lines), only. the driver error signal prim_nerror_out is operati onal after 56ms. without any error present, the error signal will be reset. to assure a high level of system safety the top an d bot signal inputs should stay in a defined state (off state, low) during driver turn-on time. only a fter the end of the power-on-reset, igbt switching operation shall be permitted. 3.6. gate driver signals ? primary the signal transfer to each igbt is made with pulse transformers, used for switching on and switching off of the igbt. the inputs have a schmitt trigger characteris tic and a positive / active high logic (input high = igbt on; input low = igbt off). it is mandatory to use circuits which switch active to +15v and 0v. pull up and open collector output stages must not be used for top / bot control signals. it is recommended choosing the line drivers according to the demanded length of the signal lines. the duty cycle of the driver can be adjusted between 0 ? 100%. it is not permitted to apply switching pulses shorter than 1 s. top / bot input a capacitor is connected to the input to obtain high noise immunity. this capacitor can cause for current limited line drivers a little delay of few ns, which can be neglected. the capacitors have to be placed as close as possible to the driver interface. please note: do not apply switching signals during power on reset.
skyper ? 42 r 10 2011-04-04 ? rev05 ? by semikron 3.7. shut down input (sdi) - primary the shut down input / error input signal can gather error signals of other hardware components for swi tching off the igbt (input high = no turn-off; input low = tur n-off). connection sdi hints a low signal at prim_nerror_in will set the error latch and force the output prim_nerror_out into high state. switching pulses from the controller will be ignore d. the sdi function can be disabled by no connection or connecting to 5v. 3.8. gate resistors - secondary the output transistors of the driver are mosfets. t he sources of the mosfets are separately connected to external terminals in order to provide setting of t he turn-on and turn-off speed of each igbt by the e xternal resistors r gon and r goff . as an igbt has input capacitance (varying during switching time) which must be charged and discharged, both resistors will dictate what time must be taken to do this. the final valu e of the resistance is difficult to predict, because it depe nds on many parameters as dc link voltage, stray in ductance of the circuit, switching frequency and type of igbt. connection r gon , r goff application hints the gate resistor influences the switching time, s witching losses, dv/dt behaviour, etc. and has to be selected very c arefully. the gate resistor has to be optimized according to the specific application. by increasing r gon the turn-on speed will decrease. the reverse peak current of the free-wheeling diode will dimini sh. by increasing r goff the turn-off speed of the igbt will decrease. the inductive peak over voltage during turn-off wil l diminish. in order to ensure locking of the igbt even when t he driver supply voltage is turned off, a resistance (r ge ) has to be integrated. tpically, igbt modules with a large current rating will be driven with smaller gate resistors and vice versa. te value of gate resistors will be between the val ue indicated in the igbt data sheet and roughly twice this value. in most applications, the turn-on gate resistor rg (on) is smaller than the turn-off gate resistor rg(off). depending on the individual parameters, rg(off) ca n be roughly twice the rg(on) value. place the gate resistances for turn-on and turn-off close together. please note: do not connect the terminals sec_top_igbt_on with s ec_top_igbt_off and sec_bot_igbt_on with sec_bot_igbt_off, respectively.
skyper ? 42 r 11 2011-04-04 ? rev05 ? by semikron 3.9. external boost capacitors (bc) -secondary the rated gate charge of the driver may be increase d by additional boost capacitors to drive igbt with large gate capacitance. connection external boost capacitors dimensioning of c boost skyper 42 r has internal gate capacitors of 2.5 c using external capacitors: 4f = 1c the boost capacitors on c15 and c-8 should be chos en with the same values please consider the maximum rating four output cha rge per pulse of the gate driver. the external boost capacitors should be connected as close as possible to the gate driver and to have low inducta nce. 4. protection features 4.1. failure management any error detected will set the error latch and for ce the output prim_nerror_out into high state. swit ching pulses from the controller will be ignored. connect ed and switched off igbts remain turned off. the s witched off igbts remain turned off. the output prim_nerror_out is an open collector out put. for the error evaluation an external pull-up- resistor is necessary pulled-up to the positive ope ration voltage of the control logic (low signal = n o error present, wire break safety is assured). open collector error transistor application hints an external resistor to the controller logic high level is required. the resistor has to be in the range of v / i max < r pull_up < 10k . rest when top/bot signals set to low for t perrreset > 9s prim_nerror_out can operate to maximum 30v and can switch a maximum of 15ma. example: for v = +15v the needed resistor should be in the r ange r pull_up = (15v/15ma) ? 10k ? 1k ? 10k . please note: the error output prim_error_out is not short circui t proof.
skyper ? 42 r 12 2011-04-04 ? rev05 ? by semikron 4.2. under voltage protection of driver power suppl y (uvp) the internally detected supply voltage of the drive r has an under voltage protection. supply voltage uvp level regulated +15v 4% typ 13,5v if the internally detected supply voltage of the dr iver falls below this level, the igbts will be swit ched off (igbt driving signals set to low). the input side switchi ng signals of the driver will be ignored. the error memory will be set, and the output prim_nerror_out changes to t he high state. 4.3. short pulse suppression (sps) this circuit suppresses short turn-on and off-pulse s of incoming signals. this way the igbts are prote cted against spurious noise as they can occur due to bur sts on the signal lines. pulses shorter than 625ns are suppressed and all pulses longer than 750ns get thr ough for 100% probability. pulses with a length in- between 625ns and 750ns can be either suppressed or get thr ough. pulse pattern ? sps short pulses prim_top/bot_in(high) prim_top/bot_in(low) sec_top/bot_igbt_on sec_top/bot_igbt_off 4.4. dead time generation (interlock top / bot) (dt ) the dt circuit prevents, that top and bot igbt of o ne half bridge are switched on at the same time (sh oot through). the dead time is not added to a dead tim e given by the controller. thus the total dead time is the maximum of "built in dead time" and "controller dea d time". it is possible to control the driver with one switching signal and its inverted signal. pulse pattern ? dt the total propagation delay of the driver is the s um of interlock dead time (t td ) and driver input output signal propagation delay (t d(on;off)io ) as shown in the pulse pattern. moreover the switching time of the igbt chip has to be taken into account (not shown in the pulse pattern). in case both channel inputs (prim_top_in and prim_bot_in) are at high level, the igbts will be t urned off. if only one channel is switching, there will be no interlock dead time. please note: the genera ted dead time is fixed at 2 s and cannot be change d. please contact your resonsible sales engineer fo r customization. please note: no error message will be generated when overlap of switching signals occurs.
skyper ? 42 r 13 2011-04-04 ? rev05 ? by semikron 4.5. dynamic short circuit protection by vcesat mon itoring (dscp) the dscp monitors the collector-emitter voltage v ce of the igbt during its on-state. the reference voltage v ceref may dynamically be adapted to the igbts switching behaviour. immediately after turn-on of the igbt, a higher value is effective th an in steady state. v cestat is the steady-state value of v ceref and is adjusted to the required maximum value for each igbt by an external resistor r ce . it may not exceed 10v. the time constant for the delay (exponential shape) of v ceref may be controlled by an external capacitor c ce. it controls the blanking time t bl which passes after turn-on of the igbt before the v cesat monitoring is activated. reference voltage (v ceref ) characteristic after t bl has passed, the v ce monitoring will be triggered as soon as v ce > v ceref and will turn off the igbt. the error memory will be set, and the output prim_nerro r_out changes to the high state. possible failure modes are shows in the following pictures. short circuit during operation turn on of igbt too slow * short circuit during turn on * or adjusted blanking time too short
skyper ? 42 r 14 2011-04-04 ? rev05 ? by semikron dimensioning of r ce and c ce u detect.1200v.typ r conf ( ) 10.5 v ? r conf 10 k ? r conf + ? := v 1 5.62 6.62 10.5 ? v ? := v 2 10.5 v ? 5.62 := v 1 8.914 v = v 2 1.868 v = u detect.1700v.typ r conf ( ) v 1 r conf 10 k ? r conf + ? v 2 ? := t d t durchlauf.komparator 1 := t 1 5.62 k ? 33 ? pf ? := t 1 185.46 10 9 ? s = t d 440 10 9 ? s = t ausblend.1200vtyp r conf c conf , ( ) r conf 10 ? k ? r conf 10 k ? + c conf ? t 1 + ? ? ? ? ? ? ? ? ln 15v u detect.1200v.typ r conf ( ) ? 10.5 v ? u detect.1200v.typ r conf ( ) ? ? ? ? ? ? ? ? t d + := t ausblend.1700vtyp r conf c conf , ( ) r conf 10 ? k ? r conf 10 k ? + c conf ? t 1 + ? ? ? ? ? ? ? ? ln 15v u detect.1700v.typ r conf ( ) ? 10.5 v ? u detect.1700v.typ r conf ( ) ? ? ? ? ? ? ? ? t d + := u detect.1200v.typ 18.2 k ? ( ) 6.777 v = t ausblend.1200vtyp 18.2 k ? 337 pf ? , ( ) 2.31 10 6 ? s = if the dscp function is not used, for example durin g the experimental phase, sec_top_vce_in must be co nnected with sec_top_gnd for disabling scp @ top side and sec_bo t_vce_in must be connected with sec_bot_gnd for dis abling scp @ bot side. the high voltage during igbt off state is blocked b y a high voltage diode. connection high voltage diode characteristics reverse blocking voltage of the diode shall be hig her than the used igbt. reverse recovery time of the fast diode shall be l ower than v ce rising of the used igbt. forward voltage of the diode: 1,5v @ 2ma forward c urrent (t j =25c). a collector series resistance r vce (1k / 0,4w) must be connected for 1700v igbt operation.
skyper ? 42 r 15 2011-04-04 ? rev05 ? by semikron 5. electrical characteristic 5.1. driver performance the driver is designed for application with half br idges or single modules and a maximum gate charge p er pulse < 100c (2,5c on the driver). the charge necessary to switch the igbt is mainly depending on the igbt? s chip size, the dc-link voltage and the gate voltage. thi s correlation is shown in module datasheets. it sho uld, however, be considered that the driver is turned on at +15v and turned off at -8v. therefore, the gate voltage will change by 22v during each switching procedure. the medium output current of the driver is determi ned by the switching frequency and the gate charge. calculation switching frequency maximum switching frequency @ different gate charge s @ tamb=25c f max : maximum switching frequency * iout avmax : maximum output average current q ge : gate charge of the driven igbt * @ t amb =25c 0 khz 20 khz 40 khz 60 khz 80 khz 100 khz 1 c 10 c 100 c gate charge switching frequency 5.2. insulation magnetic transformers are used for insulation betwe en gate driver primary and secondary side. the tran sformer set consists of pulse transformers which are used b idirectional for turn-on and turn-off signals of th e igbt and the error feedback between secondary and primary si de, and a dc/dc converter. this converter provides a potential separation (galvanic separation) and powe r supply for the two secondary (top and bot) sides of the driver. thus, external transformers for external po wer supply are not required. creepage and clearance distance mm creepage distance primary to secondary (reinforced according to en50178) 12,2 clearance distance primary to secondary (reinforced according to en50178) 8 creepage distance secondary to secondary (according to en50178) 6,1 clearance distance secondary to secondary (accordin g to en50178) 4,1 insulation parameters rating climatic classification pollution degree (pd) pd2 maximum altitude (above sea level) 2000 meter above sea overvoltage category (according to en50178) ovc 3 isolation resistance test, prim-sec 4000 vdc/ac, rms,2s rated insulation voltage (en60664-1) 8 kv kat. iii ge max av max q iout f =
skyper ? 42 r 16 2011-04-04 ? rev05 ? by semikron 6. environmental conditions environmental condition norm / standard parameter operating temperature -40.. +85 c storage temperature -40.. +85 c high humidity din 45930 cecc 50012 85 c, 85% flammability vdv 150 din 5510 pren 100 heavy flammable materials only rohs / weee / china rohs emc condition norm / standard parameter esd din en 61000-4-2 din en 61800-3 6 kv contact discharge / 8 kv air discharge burst din en 61000-4-4 din en 61800-3 2kv on adaptor board for signal lines immunity against external interference din en 61000-4-3 din en 61800-3 30v/m 30mhz ? 1000 mhz immunity against conducted interference din en 61000-4-3 din en 61800-3 20v 150khz ? 80mhz conditions values (max.) vibration sinusoidal 20hz ? 500hz, 5g, 2h per axis (x, y, z) random 20hz ? 2000hz, 5g, 2 h per axis (x, y, z) shock 6000 shocks (6 axis; +-x, +-y, +-z, 1000 shocks per axis), 30g, 18ms - connection between driver core and printed circui t board mechanical reinforced by using support posts.
skyper ? 42 r 17 2011-04-04 ? rev05 ? by semikron 7. marking every driver core is marked. the marking contains t he following items. disclaimer semikron reserves the right to make changes without f urther notice herein to improve reliability, functi on or design. information furnished in this document is believed to be accurate and reliable. however, no representa tion or warranty is given and no liability is assumed with respect to t he accuracy or use of such information. semikron does not assume any liability arising out of the application or use of any product or circuit described herein. furthe rmore, this technical information may not be considered as an assurance o f component characteristics. no warranty or guarant ee expressed or implied is made regarding delivery, performance or suitability. this document supersedes and replac es all information previously supplied and may be superseded by update s without further notice. semikron products are not authorized for use in life support appliances and systems without the express written approval by semikron. www.semikron.com

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